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论文编号：	7271
作者编号：	2120132949
上传时间：	2015/6/4 10:54:48
中文题目：	飞思卡尔公司芯片封装测试流程优化研究
英文题目：	Freescale IC Assembly and Test Flow Optimization Research
指导老师：	李勇建
中文关键字：	飞思卡尔，芯片测试，流程优化，节点重构
英文关键字：	Freescale, IC Test, Flow Optimization, Node Relocation
中文摘要：	随着信息时代的到来，各类电子产品已经成为生活必需品，半导体芯片产业也进入了高速发展期。芯片企业一方面要不断推出新产品丰富产品线满不同客户的需求，同时又要降低成本，缩短生产周期，为企业赢得竞争优势。企业需要提高生产运营管理水平来满足和适应这些要求。 如今的芯片集成度越来越高，功能也越来越复杂，对芯片的测试要求也越来越严格，芯片测试设备不断升级，测试成本占芯片总成本的比例已经提升至30%以上。芯片测试方法的创新以及测试流程的优化不但可以大幅度缩减测试本身的成本，而且通过优化还可以降低库存，减少浪费，改善供应商管理，提高企业的整体运营效率。 本文通过对飞思卡尔公司天津封装测试工厂的生产运营现状进行分析，发现当前工厂在生产中存在的主要问题，即各部门在制品库存种类多、数量大，应对订单波动能力差、测试效率低、浪费严重等问题。针对上述问题通过运用库存管理、流程管理和精益管理等相关理论方法进行分析，找出制程中的关键节点，识别技术上的限制并进行技术攻关，将取得的重大技术突破和先进测试方法应用到生产中，以技术突破和方法创新为基础，以流程管理和运营管理的基本理论和方法为指导，使技术和管理相结合，以管理为目的以技术为手段，给出芯片封装测试生产流程的优化方案，并对改进效果进行评估。优化改进后在产品库存大幅降低，测试步骤精简测试时间缩短，生产中浪费减少，同时也提高生产的灵活性。 论文的创新之处在于以存在的问题为切入点，通过理论分析，给出改善方案，再以此为立足点，寻求技术突破，反向促进推动技术创新。而且本文在进行流程优化时没有照搬业务流和工作流优化的方法和工具，也未完全遵照精益生产的思想一味的进行步骤的缩减及合并，而是针对产品特点对某个环节进行适当的拆分。本文研究的优化有助于公司降低成本提升运营效率，同时也希望对行业内的其他企业具有一定帮助和借鉴意义。
英文摘要：	With the coming of the information age, all kinds of electronic products have become the necessities of life. The semiconductor chip industry has entered into a high-speed development period. Chip companies need continue to launch new products to enrich the product line with the needs of different customers, and at the same time, reduce the cost, shorten the production cycle, to win a good position in competitive for enterprises. This requires better operation management. Nowadays the chips are becoming smaller but their function is more complex than before. And IC test equipments are ceaselessly upgrading, testing costs account for the total cost of chip ratio has increased to more than 30%. Testing method innovation, testing process optimization can greatly reduce production cost. In order to achieve high operation efficiency and reduce total cost, manufacturers have to focus on test methods and flow optimization. By analyzing the current situation of production operations of Freescale Tianjin manufacturing, the main problems existing in the current factory in the production are shown. They are huge WIP inventory, poor production flexibility, low Overall Equipment Effectiveness and test low yield issue. In view of the above problems by applying relevant theory methods of inventory management，process management and lean management are analyzed, find out the key node in process, identify technical limitations and find a way to make if possible. Base on technological breakthroughs, together with advanced testing method, provide an assembly and test flow optimizing plan to improve current flow and do evaluation on the improvements. The results are product inventory substantially reduced, test time shorted and production waste reduced. The flexibility of the production is also improved. The innovation of the paper is analyzing existing problem and present a way firstly even if it has technical limitation. And then seek technical breakthrough and make if possible by finding a new method to take the place of the old one. Further more in this paper the test flow optimization does not copy the methods and tools of business flow and workflow optimization, also does not fully comply with the thinking of lean production to remove or merge steps. According to the product characteristics, some steps even are split to make the whole flow more efficient and flexible. Optimization of this study will help the factory to reduce costs and improve operating efficiency, and also hope it has certain help and reference to the other companies in the same IC field.
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