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论文编号：	15923
作者编号：	2320233746
上传时间：	2025/12/14 10:41:09
中文题目：	基于汽车零缺陷框架的X公司汽车芯片质量改进研究
英文题目：	Research on Quality Improvement of Company X Automotive Chips Based on the Automotive Zero Defects Framework
指导老师：	焦媛媛
中文关键字：	汽车零缺陷框架；汽车芯片；质量改进；质量管理体系
英文关键字：	Automotive Zero-Defect Framework；Automotive chips；Quality improvement；Quality management system
中文摘要：	随着汽车电动化、智能化和网联化趋势的加速，汽车芯片作为汽车电子控制系统的核心部件，其质量对汽车的安全性和可靠性越来越关键。在半导体技术封锁和中国政府大力支持的背景下，国内汽车半导体企业数量大幅增加，但目前国产汽车芯片的质量水平与国际知名汽车芯片企业相比仍存在较大差距，产品只能应用于对安全性和可靠性要求不高的汽车部件，例如车窗、雨刷、氛围灯等。而在车辆底盘控制、刹车控制、加速控制、安全气囊等密切关乎人身安全的应用场景中，国产汽车芯片的质量水平尚无法给予汽车厂商足够的信心，有待进一步提升。 本文按照“提出问题—分析问题—解决问题”的逻辑思路，对X公司的汽车芯片质量开展改进研究。首先，在调研X公司概况、芯片设计与生产流程以及质量管理现状的基础上，提出产品设计一次成功率不达标和客户端失效率不达标两大主要质量问题，并将这两大问题分解为八个细分问题。接着，基于汽车零缺陷框架理论，针对这八个问题实施改进，并将该理论和方法融入X公司的质量管理体系，形成长效质量管理机制。最后，从人力资源、组织管理、质量文化、技术应用四个方面制定保障措施，为汽车零缺陷框架理论和方法在X公司的有效应用与持久发展提供了体系化支持。质量改进后，产品设计一次成功率从75%左右提升至80%以上，达到了公司设定的目标；客户端失效率从约百万分之2.1降低至约百万分之1，接近公司的零缺陷目标。 汽车零缺陷框架理论并非传统的克劳士比零缺陷理论，而是在传统零缺陷理念基础上，结合汽车电子行业对高安全性和高可靠性的要求，发展出的更具体化、系统化的质量管理框架。本文将其应用于X公司的汽车芯片质量改进及质量管理体系升级，是对该理论的深化与实现，为国内汽车芯片行业提供了一套可借鉴的经验与方法，具有一定的实践创新性和参考价值。
英文摘要：	In the context of accelerated automotive electrification, intelligence, and connectivity, automotive chips have become critical components determining vehicle safety and reliability. Against the backdrop of global semiconductor technology restrictions and strong policy support in China, the number of domestic automotive chip enterprises has increased significantly. However, there remains a substantial gap between the quality level of domestic chips and that of leading international manufacturers. Currently, domestic products are mainly used in non-safety-critical components such as windows, wipers, and ambient lighting, while their application in safety-critical domains including chassis control, braking, acceleration, and airbags remains limited due to insufficient quality assurance, which fails to instill confidence in automakers and requires urgent enhancement. Guided by the analytical framework of “problem identification, analysis, and solution,” this study conducts a quality improvement case analysis focused on Company X’s automotive chips. Based on an overview of the company’s operations, chip design and production processes, and current quality management system, two core quality problems are identified: low first-pass success rate in product design and excessive customer failure rate. These problems are decomposed into eight sub-problems. Utilizing the Automotive Zero-Defect Framework—a systematic quality management approach developed for high-reliability requirements in the automotive electronics industry—targeted improvements are implemented. Furthermore, this framework is integrated into Company X’s quality management system to establish a long-term mechanism for sustained quality control. Support measures are designed from four perspectives: human resources, organizational structure, quality culture, and technological application, providing comprehensive support for the effective implementation and sustainable development of the automotive zero-defect system. After implementation, the first-pass design success rate increased from about 75% to over 80%, achieving the company’s set target, while the customer failure rate decreased from approximately 2.1 parts per million to around 1 parts per million, approaching the zero-defect objective. It should be noted that the Automotive Zero-Defect Framework is not the traditional Crosby zero-defect theory but a specialized management framework that incorporates the high safety and reliability requirements of the automotive electronics industry into a concrete and systematic quality management architecture. This thesis applies the theory to the quality improvement of automotive chips and the upgrade of the quality management system at Company X, representing a deepening and realization of the theory. It provides a set of referential experiences and methods for the domestic automotive chip industry, demonstrating certain practical innovation and reference value.
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